Polishing apparatus

ABSTRACT

A polishing apparatus has a polishing table ( 12 ) with a polishing surface ( 10 ) attached thereon, and a top ring ( 20 ) for pressing a workpiece (W) against the polishing surface ( 10 ). The top ring ( 20 ) has a housing ( 40 ) and a retainer ring ( 44 ) vertically movable in the housing ( 40 ) for holding an outer circumferential edge of the workpiece (W). The polishing apparatus includes a vertically moving mechanism operable to vertically move the top ring ( 20 ), a bracket ( 28 ) vertically movable together with the top ring ( 20 ), a stopper ( 32 ) adjustable in vertical position to prevent downward movement of the bracket ( 28 ), and a sensor ( 36 ) for detecting a distance between the stopper ( 32 ) and the bracket ( 28 ). The polishing apparatus also includes a control unit ( 34 ) operable to adjust the stopper ( 32 ) in vertical position when the retainer ring ( 44 ) is brought into contact with the polishing surface ( 10 ) while a lower surface of the housing ( 40 ) of the top ring ( 20 ) is located, at a predetermined height from the polishing surface ( 10 ) so that the distance between the stopper ( 32 ) and the bracket ( 28 ) is equal to a difference between a height of the lower surface of the housing ( 40 ) from the polishing surface ( 10 ) at the time of polishing and the predetermined height.

TECHNICAL FIELD

The present invention relates to a polishing apparatus, and moreparticularly to a polishing apparatus for polishing a workpiece such asa semiconductor wafer to a flat mirror finish. The present inventionalso relates to a method of adjusting such a polishing apparatus.

BACKGROUND ART

As semiconductor devices have become more highly integrated in recentyears, circuit interconnections have become finer and distances betweenthose circuit interconnections have become smaller. In the case ofphotolithography, which can form interconnections that are at most 0.5μm wide, it is required that surfaces on which pattern images are to befocused by a stepper should be as flat as possible because the depth offocus of an optical system is relatively small. In order to planarizesuch a semiconductor wafer, there has been used a polishing apparatusfor performing chemical mechanical polishing (CMP).

This type of polishing apparatus comprises a polishing table having apolishing pad (polishing cloth) attached thereon, and a top ring forholding a workpiece to be polished, such as a semiconductor wafer, in amanner such that a surface to be polished faces the polishing table. Thepolishing pad has an upper surface serving as a polishing surface. Inthis polishing apparatus, the polishing table and the top ring areindependently rotated, and, while an abrasive liquid (slurry) is beingsupplied onto the polishing pad, a workpiece is pressed against thepolishing pad on the polishing table at a predetermined pressure by thetop ring. Thus, a surface of the workpiece is polished to a flat mirrorfinish.

When such a polishing apparatus is used to polish a workpiece, in orderto achieve a desired polishing performance, it is required to adjustvertical positions of components in the top ring at the time ofpolishing. Conventionally, block gauges have been used to adjustvertical positions of the components in the top ring. Specifically,block gauges having a predetermined thickness are interposed between thepolishing surface and the components, and then the top ring is lowereduntil the top ring is brought into contact with the block gauges on thepolishing surface. Thus, vertical positions of the components at thetime of polishing are adjusted by the block gauges.

However, according to the conventional method, it is necessary tomanually adjust the vertical positions of the components with the blockgauges. Therefore, it troublesome and time-consuming to adjust thevertical positions of components in a top ring according to theconventional method. Further, with regard to components which have notbeen adjusted in vertical position with block gauges, once suchcomponents are worn, the vertical positions of the components cannot bereadjusted according to the conventional method.

DISCLOSURE OF INVENTION

The present invention has been made in view of the above drawbacks. Itis, therefore, an object of the present invention to provide a polishingapparatus which can automatically adjust positions of components in atop ring in a short period of time and can prevent abrasion of apolishing surface.

Another object of the present invention is to provide a method ofadjusting a polishing apparatus which can automatically adjust positionsof components in a top ring in a short period of time and can preventabrasion of a polishing surface.

According to a first aspect of the present invention, there is provideda polishing apparatus having a polishing table with a polishing surfaceattached thereon and a top ring for pressing a workpiece against thepolishing surface. The top ring has a housing and a retainer ringvertically movable in the housing for holding an outer circumferentialedge of the workpiece. The polishing apparatus includes a verticallymoving mechanism operable to vertically move the top ring, a bracketvertically movable together with the top ring, a stopper adjustable invertical position to prevent downward movement of the bracket, and asensor for detecting a distance between the stopper and the bracket. Thepolishing apparatus also includes a control unit operable to adjust thestopper in vertical position when the retainer ring is brought intocontact with the polishing surface while a lower surface of the housingof the top ring is located at a predetermined height from the polishingsurface so that the distance between the stopper and the bracket isequal to a difference between a height of the lower surface of thehousing from the polishing surface at the time of polishing and thepredetermined height. The predetermined height should preferably bedefined as a height of the housing of the top ring when the housing ismoved to an uppermost position with respect to the retainer ring.

With the above arrangement, even if the polishing surface, e.g., apolishing pad, becomes thinner, the vertical position of the stopper canautomatically be readjusted so that the housing of the top ring islocated at a desired position to have a desired bridge height. Thus, itis possible to automatically adjust the bridge height in a short periodof time. With the conventional method, if an expendable component in thetop ring, e.g., the retainer ring, is worn, then the bridge heightcannot be readjusted. According to the present invention, even if suchan expendable component in the top ring is worn, the bridge height canbe readjusted in the above manner.

According to a second aspect of the present invention, there is provideda polishing apparatus having a polishing table with a polishing surfaceattached thereon and a top ring for pressing a workpiece against thepolishing surface. The top ring has a retainer ring for holding an outercircumferential edge of the workpiece, and a vertically movable chuckingplate to hold the workpiece on a lower surface thereof. The polishingapparatus includes a vertically moving mechanism operable to verticallymove the top ring, a bracket vertically movable together with the topring, a stopper adjustable in vertical position to prevent downwardmovement of the bracket, and a sensor for detecting a distance betweenthe stopper and the bracket. The polishing apparatus also includes acontrol unit operable to adjust the stopper in vertical position whenthe workpiece held on the lower surface of the vertically movablechucking plate is brought into contact with the polishing surface whilea lower surface of the retainer ring of the top ring is located at apredetermined height from the polishing surface so that the distancebetween the stopper and the bracket is equal to a difference between aheight of the lower surface of the retainer ring from the polishingsurface at the time of polishing and the predetermined height. Thepredetermined height should preferably be defined as a height of theretainer ring of the top ring when the retainer ring is moved to anuppermost position with respect to the chucking plate.

With the above arrangement, it is possible to automatically adjust thevertical position of the stopper so that the retainer ring of the topring is located at a desired position. The workpiece can be polished ina state in which the retainer ring is above the polishing surface toprevent abrasion of the polishing surface by the retainer ring.

According to a third aspect of the present invention, there is provideda polishing apparatus having a polishing table with a polishing surfaceattached thereon and a top ring for pressing a workpiece against thepolishing surface. The polishing apparatus includes a vertically movingmechanism operable to vertically move the top ring, a bracket verticallymovable together with the top ring, and a stopper adjustable in verticalposition to prevent downward movement of the bracket. The polishingapparatus also includes a control unit operable to adjust the stopper invertical position.

According to a fourth aspect of the present invention, there is provideda polishing apparatus having a polishing table with a polishing surfaceattached thereon and a top ring for pressing a workpiece against thepolishing surface. The top ring has a housing and a retainer ringvertically movable in the housing for holding an outer circumferentialedge of the workpiece. The polishing apparatus includes a verticallymoving mechanism operable to vertically move the top ring, a bracketvertically movable together with the top ring, a stopper adjustable invertical position to prevent downward movement of the bracket, and asensor for detecting a distance between the stopper and the bracket. Thepolishing apparatus also includes a control unit operable to adjust thestopper in vertical position based on a distance signal from the sensor.

According to a fifth aspect of the present invention, there is provideda method of adjusting a polishing apparatus. The polishing apparatus hasa polishing table having a polishing surface attached thereon, and a topring for pressing a workpiece against the polishing surface. The topring has a housing, and a retainer ring vertically movable in thehousing for holding an outer circumferential edge of the workpiece. Theretainer ring is brought into contact with the polishing surface while alower surface of the housing of the top ring is located at apredetermined height from the polishing surface. A distance between thestopper and the bracket is detected. The stopper is adjusted in verticalposition so that the distance between the stopper and the bracket isequal to a difference between a height of the lower surface of thehousing from the polishing surface at the time of polishing and thepredetermined height. The predetermined height should preferably bedefined as a height of the housing of the top ring when the housing ismoved to an uppermost position with respect to the retainer ring.

According to a sixth aspect of the present invention, there is provideda method of adjusting a polishing apparatus. The polishing apparatus hasa polishing table having a polishing surface attached thereon, and a topring for pressing a workpiece against the polishing surface. The topring has a retainer ring for holding an outer circumferential edge ofthe workpiece and a vertically movable chucking plate to hold theworkpiece on a lower surface thereof. The workpiece held on the lowersurface of the vertically movable chucking plate is brought into contactwith the polishing surface while a lower surface of the retainer ring ofthe top ring is located at a predetermined height from the polishingsurface. A distance between the stopper and the bracket is detected. Thestopper is adjusted in vertical position so that the distance betweenthe stopper and the bracket is equal to a difference between a height ofthe lower surface of the retainer ring from the polishing surface at thetime of polishing and the predetermined height. The predetermined heightshould preferably be defined as a height of the retainer ring of the topring when the retainer ring is moved to an uppermost position withrespect to the chucking plate.

The above and other objects, features, and advantages of the presentinvention will be apparent from the following description when taken inconjunction with the accompanying drawings which illustrate preferredembodiments of the present invention by way of example.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic view showing a polishing apparatus according to afirst embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view showing a top ring of thepolishing apparatus shown in FIG. 1;

FIG. 3 is a schematic view showing a state of the polishing apparatusshown in FIG. 1 when a stopper is adjusted in its vertical position;

FIG. 4 is a schematic view showing a state of the polishing apparatusshown in FIG. 1 when a wafer is polished;

FIG. 5 is a schematic cross-sectional view showing a top ring accordingto a second embodiment of the present invention; and

FIG. 6 is a schematic view showing a state of the top ring shown in FIG.5 when a wafer is polished.

BEST MODE FOR CARRYING OUT THE INVENTION

A polishing apparatus according to embodiments of the present inventionwill be described below with reference to FIGS. 1 through 6. In FIGS. 1through 6, like or corresponding components are designated by the samereference numerals and will not be described repetitively.

FIG. 1 is a schematic view showing a polishing apparatus according to afirst embodiment of the present invention. As shown in FIG. 1, thepolishing apparatus has a polishing table 12 having a polishing pad 10attached thereon, a support shaft 14, a top ring head 16 connected to anupper end of the support shaft 14, a top ring shaft 18 attached to afree end of the top ring head 16, and a top ring 20 coupled to the topring shaft 18. For example, the top ring 20 is in the form of a circularplate. The polishing table 12 is coupled to a motor (not shown) disposedbelow the polishing table 12 via a table shaft 12 a. Thus, when themotor is actuated, the polishing table 12 is rotated about the tableshaft 12 a. The polishing apparatus has a polishing liquid supply nozzle22 disposed above the polishing table 12. The polishing liquid supplynozzle 22 supplies a polishing liquid to the polishing pad 10 on thepolishing table 12.

The top ring head 16 has a rotation motor 24 mounted on an upper surfaceof the top ring head 16. The rotation motor 24 has a shaft coupled tothe top ring shaft 18 via a belt (not shown) disposed in the top ringhead 16. Thus, when the rotation motor 24 is actuated, the top ringshaft 18 is rotated via the belt, so that the top ring 20 is rotatedabout the top ring shaft 18. The top ring head 16 is mounted on theupper end of the support shaft 14 so as to pivot on the support shaft14. The support shaft 14 has a pivotal movement motor 26 coupled to alower end of the support shaft 14. Thus, when the pivotal movement motor26 is actuated, the top ring head 16 pivots on a horizontal plane on thesupport shaft 14.

The top ring shaft 18 is vertically movable so as to lift and lower thetop ring 20. The top ring shaft 18 has a bracket 28 provided at an upperportion of the top ring shaft 18. The bracket 28 is vertically movedtogether with the top ring shaft 18. The top ring head 16 has an aircylinder 30 connected to a portion of the bracket 28. The air cylinder30 serves as a vertically moving mechanism operable to vertically movethe top ring shaft 18 and the top ring 20 via the bracket 28 withrespect to the top ring head 16. Thus, the top ring 20 is verticallymoved by actuation of the air cylinder 30.

The top ring head 16 has a control unit 34 disposed in the top ring head16, and a stopper 32 connected to the control unit 34. The stopper 32 isarranged so that the vertical position of the stopper 32 is adjustableby the control unit 34. The control unit 34 controls the verticalposition of the stopper 32. When the bracket 28 is brought into contactwith an upper surface of the stopper 32, the stopper 32 prevents furtherdownward movement of the top ring 20. The bracket 28 has a sensor 36 fordetecting a distance between an upper surface of the stopper 32 and thebracket 28.

FIG. 2 is a schematic cross-sectional view showing the top ring 20 ofFIG. 1. The top ring 20 serves to press a workpiece such as a wafer Wagainst the polishing pad 10. As shown in FIG. 2, the top ring 20 has ahousing 40 connected to a lower end of the top ring shaft 18, avertically movable sub-carrier 42 housed in the housing 40, and aretainer ring 44 disposed at a peripheral portion of the wafer W. Theretainer ring 44 serves to hold an outer circumferential edge of thewafer W. The retainer ring 44 is located between a peripheral portion 40a of the housing 40 and the sub-carrier 42.

The sub-carrier 42 is attached to the housing 40 by an upper diaphragm46 and a lower diaphragm 48. The diaphragms 46 and 48 are made of anelastic membrane. Thus, the sub-carrier 42 is arranged so as to bevertically movable with respect to the housing 40 via the diaphragms 46and 48. The retainer ring 44 has an upper portion connected to the lowerdiaphragm 48 and is vertically movable with respect to the housing 40via the lower diaphragm 48.

The sub-carrier 42 holds an elastic membrane 50 on a lower surface ofthe sub-carrier 42. The elastic membrane 50 defines a chamber 52 betweenthe elastic membrane 50 and the lower surface of the sub-carrier 42. Thechamber 52 can be supplied with a fluid having a predetermined pressure.By adjusting the pressure of the fluid supplied to the chamber 52, it ispossible to adjust a force to press the wafer W against the polishingpad 10. The diaphragms 46 and 48, the sub-carrier 42, and the peripheralportion 40 a of the housing 40 define a chamber 54, which can besupplied with a fluid having a predetermined pressure. By adjusting thepressure of the fluid supplied to the chamber 54, it is possible toadjust the pressure in the chamber 54.

The peripheral portion 40 a of the housing 40 has a projection 40 bextending radially inward. The retainer ring 44 has a projection 44 aextending radially outward. When the projection 44 a of the retainerring 44 is brought into contact with an upper surface of the projection40 b of the housing 40, the projection 40 b of the housing 40 preventsfurther downward movement of the retainer ring 44.

With the polishing apparatus thus constructed, the wafer W is polishedas follows. The air cylinder 30 is actuated to lower the top ring 20 sothat the bracket 28 is brought into contact with the stopper 32. Thus,the top ring 20 is lowered to a predetermined position. This position isdetermined in advance such that a distance BH (see FIG. 2) between anupper surface of the polishing pad 10 and a lower surface of theperipheral portion 40 a of the housing 40 is maintained at a desiredvalue BH₀. Such a distance BH is hereinafter referred to as a bridgeheight.

As the polishing pad 10 becomes thinner due to abrasion according to arepeated polishing process, the retainer ring 44 and the sub-carrier 42may project downward by a distance corresponding to the reduced amountof the thickness of the polishing pad 10 if the top ring 20 remainslocated at the predetermined position described above. In such a case,the diaphragms 46 and 48 are changed in shape. The shapes of thediaphragms 46 and 48 have an influence on the polishing performance ofthe wafer and are thus an important factor in the polishing process.Therefore, the diaphragms 46 and 48 are required to maintain a constantshape during the polishing process.

FIG. 2 shows an ideal state of the top ring 20 during the polishingprocess. As shown in FIG. 2, the projection 44 a of the retainer ring 44and the upper surface of the projection 40 b of the housing 40 have aclearance L therebetween. Once a desired bridge height is determined, adesired value can automatically be determined for the clearance L inconnection with the dimensions of the retainer ring 44 and theprojection 40 b of the housing 40. According to the present embodiment,the clearance L is adjusted to be a desired value L₀ to maintain adesired bridge height BH₀ in order to maintain the shapes of thediaphragms 46 and 48. The desired value L₀ should preferably bedetermined such that a sum of a reaction force of the diaphragm 48 as anelastic membrane and a force applied to the diaphragm 48 by the fluidsupplied to the chamber 54 during polishing can achieve a desiredpolishing performance. In the present embodiment, the clearance L andthe bridge height BH is adjusted as follows.

First, a desired clearance L₀ between the projection 44 a of theretainer ring 44 and the upper surface of the projection 40 b of thehousing 40 is calculated from a desired bridge height BH₀ in advance.Then, the stopper 32 is adjusted in its vertical position such that theclearance L between the projection 44 a of the retainer ring 44 and theupper surface of the projection 40 b of the housing 40 becomes the(pre-calculated) desired clearance L₀.

FIG. 3 is a schematic view showing a state of the polishing apparatuswhen the stopper 32 is adjusted in its vertical position. When thestopper 32 is adjusted in vertical position, a pressurized fluid issupplied to the chamber 54 located above the retainer ring 44 to movethe retainer ring 44 downward so that the projection 44 a of theretainer ring 44 is brought into contact with the upper surface of theprojection 40 b of the housing 40. In that state, the top ring 20 islowered without actuation of the air cylinder 30 to bring the lowersurface of the retainer ring 44 into the upper surface of the polishingpad 10. Since the top ring 20 is not pressed by the air cylinder 30, theprojection 44 a of the retainer ring 44 remains held in contact with theupper surface of the projection 40 b of the housing 40, as shown in FIG.3. In that state, the housing 40 of the top ring 20 is at an uppermostposition with respect to the retainer ring 44.

Then, the control unit 34 moves the stopper 32 and adjusts the verticalposition of the stopper 32 based on a distance signal outputted from thesensor 36 so that the distance between the stopper 32 and the bracket28, which is detected by the sensor 36, is equal to the desiredclearance L₀, as shown in FIG. 3. The adjusted position of the stopper32 determines a vertical position of the top ring 20 at the time ofpolishing. The adjusted position of the stopper 32 is stored in astorage device within the control unit 34.

FIG. 4 is a schematic view showing a state of the polishing apparatuswhen a wafer is polished. As shown in FIG. 4, when a wafer is polished,the air cylinder 30 is actuated to lower the top ring 20 until thebracket 28 is brought into contact with the upper surface of the stopper32. At that time, while the retainer ring 44 is brought into contactwith the polishing pad 10, the top ring 20 is moved downward by thedistance L₀ from the state shown in FIG. 3. Thus, a desired clearance L₀can be formed between the projection 44 a of the retainer ring 44 andthe upper surface of the projection 40 b of the housing 40. Accordingly,the lower surface of the peripheral portion 40 a of the housing 40 islocated at the desired bridge height BH₀.

As described above, in the present embodiment, the stopper 32 isadjusted in its vertical position so that the distance between thestopper 32 and the bracket 28 in the state shown in FIG. 3 is equal tothe difference between the height (BH₀) of the lower surface of thehousing 40 from the polishing pad 10 at the time of polishing and theheight of the lower surface of the housing 40 shown in FIG. 3, i.e., thedistance L₀. With this arrangement, even if the polishing pad 10 becomesthinner, the position of the stopper 32 can automatically be readjustedso that the housing 40 of the top ring 20 is located at a desiredposition to have a desired bridge height. Therefore, it is possible toautomatically adjust the bridge height in a short period of time. Withthe conventional method, if an expendable component in the top ring 20,e.g., the retainer ring 44, is worn, then the bridge height cannot bereadjusted. According to the present invention, even if such anexpendable component in the top ring 20 is worn, the bridge height canbe readjusted in the above manner.

The present invention is not limited to the top ring described above andis applicable to other types of top rings. For example, the presentinvention is applicable to a top ring 120 shown in FIG. 5. The top ring120 shown in FIG. 5 has a housing 140 connected to a lower end of a topring shaft 18, a vertically movable chucking plate 142 housed in thehousing 140, and a retainer ring 144 attached to a lower peripheral endof the housing 140.

The chucking plate 142 is attached to the housing 140 by a diaphragm 146made of an elastic membrane. The chucking plate 142 is verticallymovable with respect to the housing 140 and the retainer ring 144. Thediaphragm 146 defines a chamber 148 between the housing 140 and thechucking plate 142. The chamber 148 can be supplied with a fluid havinga predetermined pressure. By adjusting the pressure of the fluidsupplied to the chamber 148, it is possible to move the chucking plate142 vertically with respect to the housing 140 and the retainer ring144.

The chucking plate 142 holds an elastic membrane 150 on a lower surfaceof the chucking plate 142. The elastic membrane 150 defines a chamber152 between the elastic membrane 150 and the lower surface of thechucking plate 142. The chamber 152 can be supplied with a fluid havinga predetermined pressure. By adjusting the pressure of the fluidsupplied to the chamber 152, it is possible to adjust a force to pressthe wafer W against the polishing pad 10.

The chucking plate 142 has a projection 142 a extending radiallyoutward. When the projection 142 a of the chucking plate 142 is broughtinto contact with an upper surface of the retainer ring 144, theretainer ring 144 prevents further downward movement of the chuckingplate 142. The housing 140 may have a peripheral portion extendingradially inward to prevent further downward movement of the chuckingplate 142.

When the stopper 32 is adjusted in vertical position, a pressurizedfluid is supplied to the chamber 148 located above the chucking plate142 to move the chucking plate 142 downward so that the projection 142 aof the chucking plate 142 is brought into contact with the upper surfaceof the retainer ring 144. In that state, the top ring 120 is loweredwithout actuation of the air cylinder 30 to bring a wafer W held on thelower surface of the chucking plate 142 onto the surface of thepolishing pad 10. Since the top ring 120 is not pressed by the aircylinder 30, the projection 142 a of the chucking plate 142 remains heldin contact with the upper surface of the retainer ring 144. In thatstate, the housing 140 and the retainer ring 144 of the top ring 120 areat an uppermost position with respect to the chucking plate 142. Then,the control unit 34 moves the stopper 32 and adjusts the verticalposition of the stopper 32 based on a distance signal outputted from thesensor 36 so that the distance between the stopper 32 and the bracket28, which is detected by the sensor 36, is equal to a predetermineddistance H₀ (see FIG. 6). The adjusted position of the stopper 32determines a vertical position of the top ring 120 at the time ofpolishing. The adjusted position of the stopper 32 is stored in astorage device within the control unit 34.

When a wafer is polished, the air cylinder 30 is actuated to lower thetop ring 120 until the bracket 28 is brought into contact with thestopper 32. FIG. 6 shows this state of the top ring 120. As shown inFIG. 6, the wafer can be polished in a state in which the retainer ring144 is located at the predetermined height Ho from the polishing pad 10.Specifically, the wafer can be polished in a state in which the retainerring 144 is above the polishing pad 10 to prevent abrasion of thepolishing pad 10 which would otherwise be caused by the retainer ring144.

In the above embodiments, the upper surface of the polishing pad 10serves as the polishing surface which is brought into sliding contactwith the semiconductor wafer W. However, the polishing surface is notlimited to the upper surface of the polishing pad. For example, thepolishing surface may be constituted by a fixed abrasive. The fixedabrasive is formed into a flat plate comprising abrasive particles fixedby a binder. With the fixed abrasive for polishing, the polishingprocess is performed by abrasive particles that are self-generated fromthe fixed abrasive. The fixed abrasive comprises abrasive particles, abinder, and pores. For example, cerium dioxide (CeO₂) having an averageparticle diameter of 0.5 μm or less is used as an abrasive particle, andepoxy resin is used as a binder. Such a fixed abrasive forms a harderpolishing surface. The fixed abrasive includes a fixed abrasive padhaving a two-layer structure formed by a thin layer of a fixed abrasiveand an elastic polishing pad attached to a lower surface of the thinlayer of the fixed abrasive.

The present invention is suitable for use in a polishing apparatus forpolishing a workpiece such as a semiconductor wafer to a flat mirrorfinish. Although certain preferred embodiments of the present inventionhave been shown and described in detail, it should be understood thatvarious changes and modifications may be made therein without departingfrom the scope of the appended claims.

1. A polishing apparatus comprising: a polishing table having apolishing surface thereon; a top ring for pressing a workpiece againstsaid polishing surface, said top ring having a housing and a retainerring vertically movable in said housing for holding an outercircumferential edge of the workpiece; a vertically moving mechanismoperable to vertically move said top ring; a bracket vertically movabletogether with said top ring; a stopper adjustable in vertical positionto prevent downward movement of said bracket; a sensor for detecting adistance between said stopper and said bracket; and a control unitoperable to adjust said stopper in vertical position when said retainerring is brought into contact with said polishing surface while a lowersurface of said housing of said top ring is located at a predeterminedheight from said polishing surface so that the distance between saidstopper and said bracket is equal to a difference between a height ofthe lower surface of said housing from said polishing surface at thetime of polishing and said predetermined height.
 2. The polishingapparatus according to claim 1, wherein the predetermined height isdefined as a height of said housing above said polishing surface whensaid housing is moved to an uppermost position with respect to saidretainer ring.
 3. A polishing apparatus comprising: a polishing tablehaving a polishing surface thereon; a top ring for pressing a workpieceagainst said polishing surface, said top ring having a housing and aretainer ring vertically movable in said housing for holding an outercircumferential edge of the workpiece; a vertically moving mechanismoperable to vertically move said top ring; a bracket vertically movabletogether with said top ring; a stopper adjustable in vertical positionto prevent downward movement of said bracket; a sensor for detecting adistance between said stopper and said bracket; and a control unitoperable to adjust said stopper in vertical position based on a distancesignal from said sensor.